Preventing plating and soldering voids is about testing new manufacturing processes and analyzing the results. Plating and soldering voids usually have an identifiable cause, such as the type of ...
Today’s electronic packages have high clock speeds (multi-gigahertz range), fine pin densities (below 0.4-mm pitch), and high pin counts (over 2000). When assembled onto a printed-circuit board (PCB), ...
Mill-Max announced an addition to its diverse mix of press-fit pins for plated through-holes with six new offerings designed for applications where mechanical strength and/or power delivery are ...
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